• Vinay Kumar Yadav, Vishwajeet Kureel


Heat is frequently produced inside the electronic equipment’s because the electricity-conducting components are not always 100% efficient. As most electrical components cannot resist the excess heat produced, the heat must be dispersed. Practically, applications involving forced or natural convection use heat sinks. Fins are thin surfaces that extend from the heat sink base and are typically present on heat sinks. By expanding the accessible surface area for heat transmission, these fins efficiently improve the heat transfer between its surface and the surrounding air. These fins receive heat from the electrical gadgets by conduction, and the surrounding air absorbs this heat energy through convection. An aluminum heat sink and a copper plate make up the heat sink assembly. In the current work, a thermal heat sink that uses forced convectional cooling is used to cool electronic equipment. The copper plate surface receives 1000 W of thermal power in the suggested paradigm. This heat sink is forced to receive cold air, which dissipates heat. The main goal of this research was to estimate the average temperature of a copper plate in steady state and to describe the transient heat transfer phenomenon. Design modification on currently using heat sink is done. Later on, FEM analysis is done for steady state and transient heat transfer on modified designed heat sink. Based on the simulation findings, it can be shown that the increased surface area of the interrupted rectangular pin fin caused a 5.32% increase in the temperature drop. The zone of maximal heat flow was constrained close to the connection of the fins to the base plates, however the maximum heat flux occurs in interrupted rectangular pin fins. This occurrence is understandable because heat sink construction typically includes soldering fins. The heat sink is designed with these fins oriented to give a surface area that permits air to circulate through them. They are essential to the cooling process because of this. Keywords: Heat sink, forced convection, FEM analysis, Ansys, & Transient Thermal
How to Cite
Vinay Kumar Yadav, Vishwajeet Kureel. (1). A COMPREHENSIVE ANALYSIS OF PCB COOLING HEAT SINKS USING ANSYS - COMPARATIVE TRANSIENT THERMAL STUDY. International Journal Of Innovation In Engineering Research & Management UGC APPROVED NO. 48708, EFI 5.89, WORLD SCINTIFIC IF 6.33, 10(1), 19-26. Retrieved from http://journal.ijierm.co.in/index.php/ijierm/article/view/1247